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Case Studies

Individual IC Packaging

As part of an ongoing partnership with Farnell, Antistat have continued their research and development to create a new innovative solution to protect individual electronic components in transit and storage. The Issue: Damage to high cost, low volume devices caused by existing card and foam shipping solutions. The…

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ESD Bio Bags

The Client: Farnell The Issue: Farnell were keen to replace the estimated 3.6 million polythene, non recyclable bags currently used to package components despatched by Farnell in Europe each year. The Solution: Unique, fully biodegradable, static dissipative packaging solution for electronics and electronic components. This new, innovative packaging…

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